1. Visual Inspection: Visual inspection is one of the most common quality inspection methods that can be used to check the correct placement of components, polarity, solder paste quality, and solder joint appearance. Operators use microscopes or automatic visual inspection systems to inspect components and soldering on PCBs.
2. X-ray Inspection: X-ray inspection is used to check for problems with solder connections under the surface, such as soldering quality and solder joint defects. This is especially important for the inspection of BGA (Ball Grid Array) components because their solder joints are usually located at the bottom of the components.
3. AOI (Automated Optical Inspection): Automated optical inspection systems use cameras and image processing software to check component placement and solder joint quality. It can efficiently detect defects and improve production efficiency.
4. SPI (Solder Paste Inspection): Solder paste inspection is used to check the uniformity and correctness of solder paste to ensure that it is correctly applied to the PCB. This helps prevent subsequent soldering problems caused by solder paste problems.
5. ICT (In-Circuit Testing): In-circuit testing is a method used to detect the connectivity of electronic components and circuits. This includes checking component values such as resistance, capacitance and inductance, as well as detecting short and open circuit problems.
6. Flying Probe Test: Flying probe testing uses an automated probe (flying probe) to test the connectivity and electrical performance of a PCB. It is suitable for small batch production or PCBs with complex wiring.
7. Functional Testing: Functional testing is used to verify the performance of the entire electronic product. It ensures that the electronic product works properly according to specifications, including checking individual functions, communications and interfaces.
8. Environmental Testing: Environmental testing includes temperature cycling, humidity testing, vibration and shock testing, etc. to evaluate the reliability and durability of electronic products under various environmental conditions.
