At present, according to the IPC standard for the formulation of PCBA board aging, there are the following documents:
• IPC-TR-464. Aging solderability evaluation
• IPC-TR-465-1. Steam engine temperature control stability cycle test
• IPC-TR-465-2. The influence of steam aging time and temperature on solderability test results
• IPC-TR-465-3. Steam aging evaluation cycle test procedure for alternative finished products Phase IIA
Summarize the points that should be done in the following PCBA aging test standards:
• Low temperature work: After putting the control board at -10±3℃/1h, under this condition, it should be loaded with rated load. Under the conditions of 187V and 253V, power on and run all the programs. The program should be correct.
• High temperature work: After putting the control board at 80±3℃/h, under this condition, with load, under the conditions of 187V and 253V, power on and run all the programs, and the programs should be correct.
• High-temperature and high-humidity work: Put the control board at a temperature of 65±3°C and a humidity of 90-95% for 48 hours, and run the programs with rated load. Each program should be correct.
