SMT is a very common processing technology, but it involves materials (such as various solder pastes, fluxes, cleaning agents), coating technology (such as printing, welding), automatic control technology (such as equipment and production line control), testing and inspection technology Wait.
The following is a basic process content:
1. Silk screen printing: its function is to print solder paste or patch glue onto the PCB pads to prepare for the soldering of components. The equipment used is a screen printing machine (screen printing machine).
2. Dispensing: It is to drop the glue onto the fixed position of the PCB to fix the components on the PCB. The equipment used is a dispenser.
3. Mounting: the surface mount components are accurately mounted on the fixed position of the PCB. The equipment used is a placement machine.
4. Curing: Its function is to melt the patch glue, so that the surface mount components and the PCB board are firmly bonded together. The equipment used is a curing oven.
5. Reflow soldering: Melting the solder paste to make the surface mount components and the PCB firmly bonded together. The equipment used is a reflow oven.
6. Cleaning: It is to remove the solder residues such as flux that are harmful to the human body on the assembled PCB board. The equipment used is a washing machine.
7. Inspection: It is to inspect the welding quality and assembly quality of the assembled PCB board. The equipment used includes microscope, flying probe tester, automatic optical inspection (AOI), X-RAY inspection system, etc.
8. Rework: It is to rework the PCB board that has failed in the detection. The tools used are soldering iron, rework station, etc.
