With the rapid development of pcb assembly and printing, nowadays, not only the size of electronic components is getting smaller and smaller, the density of pcb assembly is getting higher and higher, and with the introduction of new packaging forms in 2019, many different type packaging technics meets different technics requirements. In order to meet the needs of high-density and difficult PCB assembly technology, the PCB assembly printing equipment is developing in the direction of highly difficult, versatility, modularity and intelligence. The following are the characteristics of PCB assembly printing equipment.
First, high speed
1.”Flight alignment” technology. The flight alignment technology mounts the CCD image sensor directly on the mounting head and moves together to achieve optical alignment of the components during the process of moving to the PCB assembly printed circuit board placement position after re-picking up the device.
2.High-speed PCB assembly and placement machine modularization.
3.Two-way conveying structure. Under remaining traditional single-channel placement machine performance condition, the transfer, positioning, and testing of PCB assembly printed circuit board is designed into two-way structure. This two-way structure PCB assembly and placement machine can be divided into synchronous mode and Asynchronous mode. When running in synchronous mode, another printed board completes the steps of transfer, reference alignment, and bad board inspection, thereby improving the production efficiency of PCB assembly manufacturing.
4.Automatic suction nozzle conversion function. Some companies in Japan and Europe have made improvements to the mounting head of the new PCB assembly and placement machine, such as the turntable and the double nozzle structure. The turntable structure automatically replaces the required suction nozzle during the movement of the mounting head, and can simultaneously pick up a plurality of components during a pick-and-place process, reducing the number of times the mounting arm moves back and forth, thereby improving the working efficiency of the PCB assembly and placement machine.
Second, high precision
At present, many PCB placement machine manufacturers adopt various technologies to meet the requirements of PCB mounting accuracy for narrow pitch and new devices, so that the highest mounting accuracy is ±0.01~±0.00127MM. The main measures are as follows.
1.A high resolution linear encoder closed loop system is used.
2.Adopt intelligent service system to improve service performance and quick-break adjustment time, reduce host load and improve the mounting reliability of pcb circuit board.
3.Improve the PCB assembly machine vision system, adopt high-resolution linear scanning camera, and perform grayscale processing on the image to improve the image processing accuracy and further improve the accuracy level of the pcb placement machine.
4.The using of temperature compensation function, reducing the impact of the environment on the pcb circuit board placement of ultra-fine pitch IC.
