As an important support of electronic information industry, the technological development of PCB industry usually needs to meet the needs of downstream electronic terminal equipment. At present, there are two obvious trends in electronic products: one is light and short, and the other is high speed and high frequency. The application requirements of downstream industries put forward higher requirements for PCB precision and stability, and PCB industry will develop in the direction of high density and high performance. High density is an important direction for the development of printed circuit board technology in the future, which puts forward higher requirements for the size of circuit board aperture, wiring width and the number of layers. High-density interconnection technology (HDI) is the embodiment of current PCB advanced technology. By accurately setting blind and buried holes, the number of through holes can be reduced, the PCB wiring area can be saved, and the component density can be greatly improved. High performance is mainly aimed at the impedance and heat dissipation of PCB. High-rise PCB board has short wiring length, low circuit impedance, high-frequency and high-speed operation and stable performance, and can undertake more complex functions, which is also the key to enhance product reliability. Therefore, downstream industries put forward higher requirements for the reliability and stability of PCB products, and at the same time, the application proportion of HDI board with higher density in future electronic products will gradually expand.
