PCBA的生产流程
PCBA 的生产流程主要包括 SMT 贴片,插件和测试三大环节.首先是 SMT 贴片,将 PCB 固定在钢网上,通过锡膏印刷机在焊盘上涂覆锡膏,再由高速贴片机按照程序将电阻,电容,IC 芯片等 SMD 元件精准贴装到相应位置,随后进入回流焊炉,通过高温使锡膏熔化实现元件与 PCB 的焊接.接着是插件环节,针对体积较大或需承受高电流的 THT 元件,如连接器,变压器等,采用波峰焊或手工焊接方式将其引脚插入 PCB 对应的通孔并焊接固定.最后进入测试阶段,通过 AOI 自动光学检测,X-ray 检测或功能测试等手段,对焊点质量和电路功能进行全面检测,确保 PCBA 符合设计要求.整个流程需严格控制温度,压力,时间等参数,并进行多道品质检验,以保障最终产品的可靠性.
PCBA Production Process
The PCBA production process primarily consists of three key stages: SMT Assembly, Through-Hole Technology (THT) Insertion, and Testing.
SMT Assembly:
The PCB is secured onto a stencil, and solder paste is applied to the pads using a solder paste printer.
A high-speed pick-and-place machine precisely positions SMD components (resistors, capacitors, IC chips, etc.) according to the programmed design.
The PCB then enters a reflow oven, where controlled heating melts the solder paste, creating permanent electrical connections between components and the PCB.
THT Insertion:
Larger components or those requiring higher current-carrying capacity (e.g., connectors, transformers) are inserted into pre-drilled holes on the PCB.
These components are soldered using wave soldering (automated for mass production) or manual soldering for specialized parts.
Testing & Quality Control:
Automated Optical Inspection (AOI) and X-ray testing verify solder joint integrity and component placement.
Functional testing ensures the PCBA meets design specifications for electrical performance.
Parameters such as temperature, pressure, and soldering time are rigorously monitored throughout the process to guarantee reliability.
Multiple quality checks are performed to ensure the final product meets industry standards and customer requirements. This systematic approach ensures the reliability and functionality of the assembled circuit board.
