SPI is a process used to detect the quality of solder paste. It is usually used before welding in the electronics manufacturing process to ensure that the solder paste is correctly applied to the solder joint position on the circuit board. SPI can help detect the viscosity, thickness, shape, and position of the paste, as well as the presence of defects, offsets, or excess paste.
The SPI process typically includes the following steps:
Preparation: Apply solder paste to the circuit board and place it on the SPI machine for inspection.
Image acquisition: The SPI machine uses an optical system to acquire images of the solder paste area. These images can be in two or three dimensions.
Image processing: Through the image processing algorithm, the acquired image is analyzed and processed to extract the characteristics and parameters of the solder paste.
