The soldering process is an important process in PCBA processing, and the connection between the pins and pads of electronic components is cooled to form solder joints after soldering. The quality of solder joints will directly affect the reliability and service life of PCBA. , once the solder joint fails, it will cause the PCBA to fail to work properly. The final result is either returning to the factory for repair or direct scrapping. Then, in the PCBA processing process, what are the reasons for the failure of the PCBA solder joints Woolen cloth?
1. The welded area is contaminated or oxidized
The soldered area refers to the position of electronic component pins and PCB pads. Once the pads or component pins are contaminated by oil, fingerprints or dust, it may lead to failure of solder joints after soldering; or due to Improper storage of electronic components and PCBs will lead to oxidation and deformation of the component pins or PCB pad surfaces, which will also lead to solder joint failure. The improvement method is to strengthen the storage environment management of PCBs and electronic components, and pay attention to storage. The temperature and humidity of the environment change, and the welding part is oxidized. Before the welding process, clean the components and the PCB board to prevent the adhesion of pollutants;
2. Quality problems of welding materials
Soldering materials include auxiliary materials such as solder, flux, and cleaning agent. If there are quality problems in these soldering materials, it will also lead to the failure of PCBA solder joints; among them, solder problems are the main reasons for the failure of solder joints, such as: incorrect solder composition ratio, excessive impurities Or oxidation caused by exposure to air for too long will affect the quality of the solder, which will lead to the failure of the solder joint; in addition, the excessive corrosiveness of the flux or insufficient soldering will also lead to the failure of the solder joint after soldering. The situation occurs; reasonable selection of flux and solder can effectively solve this problem;
3. The design is unreasonable and the process operation is negligent
Unreasonable design refers to the unreasonable design of PCB pads, such as the pad size is too long or too short, the width is too wide or too narrow, etc., and the design of pad spacing is too large, which will further lead to the failure of PCBA solder joints; In addition, the problem of improper operation during soldering will also lead to the failure of PCBA solder joints, such as inaccurate parameter settings and deviations, etc. The improvement method is to accurately adjust the position of the pads when designing the PCB pads, and accurately debug the equipment parameters during soldering.
#PCBA Solder #solder joint #pad
