ENTEK (organic solder mask process)
Advantage:
1. The upper film is uniform and flat, and there is no unevenness to facilitate SMT placement.
2. The process is not affected by high temperature impact of tin spray, and the physical properties are not affected.
3. The process is horizontal and easy to produce reasonable and efficient.
4. Environmentally friendly production process, in line with the future the development trend of PCB will be promoted in the future.
5. Non-spray tin surface treatment of uneven tin surface, through hole card tin beads, hole plug tin, tin high pressure flat, tin oxidation and other issues can improve product yield. Good weldability
Disadvantage：
1. The storage time is short, generally 6 months.
2. Solderability is worse than tin spray
3. High equipment cost
Storage time and Conditions：
1. Vacuum packaging, no acid and alkali-free environment and normal temperature (5 ° C -30 ° C), humidity <60% environment for six months.
2. Open vacuum packaging and store for one week in an acid-free and alkali-free environment
3. Reflow soldering conditions (140 ° C - 270 ° C, 8 minutes) can be repeated three times (for ENTEK syrup in lead-free process, the general type of syrup can only be twice, more than twice, film surface discoloration)
Chemical nickel gold
Advantage:
1. The coating is uniform and flat. The surface of the five-spray tin surface is not flat, the through-hole card tin beads, the hole in the tin, the tin high-pressure flat, tin oxidation and other problems are convenient for SMT placement.
2. During the process, the high temperature impact of the tin spray is not affected, and the physical properties are not affected.
3. Have good solderability.
4. Beautiful appearance
5. The product itself is an environmentally friendly product
Disadvantages:
1. The process requirements are high and the conditions are not easy to control.
2. The liquid used has toxic side effects and is not conducive to the operator.
3. Higher production costs
4. Prone to surface oxidation, uneven color, black mat, green paint side etching, poor soldering, etc.
Storage time and Conditions：
1. Vacuum packaging, no acid and alkali-free environment and normal temperature (5 °C-30 °C), humidity <60% environment for one year.
2. After vacuum packaging, it can be stored for three months in an acid-free and alkali-free environment with humidity <40%.
1. Repeated reflow conditions (140 ° C - 270 ° C, 8 minutes) can be repeated three times
