OKI Launches EMS for AI Server Equipment with High Heat Dissipation Technology
The launch addresses critical challenges in AI server production. As generative AI advances rapidly, computing resources required for AI training and inference are now several hundred times greater than for conventional cloud-based services. This has created surging demand for AI servers featuring densely mounted AI semiconductors, including GPUs and high-bandwidth memory (HBM).
AI server equipment production lines face multiple challenges: achieving high component placement accuracy, managing warping caused by thermal expansion differences between PCBs and components, heat dissipation from large numbers of AI semiconductors, detecting solder defects invisible to automated optical inspection, and the growing difficulty of reworking after mounting large, costly AI semiconductors.
OKI's solution leverages its proprietary high heat dissipation technology using embedded copper coins in PCB design, high-speed X-ray solder inspection technology, and automated functional testing. Significantly, OKI's reworking capabilities-combining proprietary jigs with skilled technicians' advanced soldering techniques-can handle AI semiconductors with over 10,000 pins. This helps customers improve yields, reduce failure costs, shorten delivery times, and enhance management efficiency.
