In the circuit board debugging and production process, welding and disassembly are essential skills. The following are some disassembly methods.
1. Soldering pot. The solder pot was originally used to pre-tin the pins of the in-line device, and the efficiency of using it to remove the components on the circuit board is also extremely high. But this method is easier to cause damage to the circuit board.
2. Tin suction device. The use of tin sucker can selectively desolder components. After heating the device pins with the soldering iron, the solder sucker removes the solder from the solder holes, and then the components can be removed.
3. Copper wire mesh. When the component pins are dense, or when the device is surface-mounted, you can use a dedicated desoldering and tin-absorbing copper wire mesh. The copper wire mesh is woven from slender brass. Place it on the pad, apply a little flux, and heat it with a soldering iron to suck up the solder inside and outside the pad.
4. Hot air gun. The hot air gun is usually used to disassemble the surface mount components on the circuit board. Align it with the disassembled device and heat it. When the temperature of the circuit board pad exceeds the melting point of the solder, the components can be easily removed.
5. Desoldering the heating plate. Compared with the solder pot, the heating plate can also uniformly heat the circuit board to a high temperature. At this time, with tweezers, hot air gun or iron, etc., the components can be disassembled and welded.
