The working temperature of PCB with different materials is different. In addition, the size of PCB copper clad area and board thickness are closely related to the temperature, so the furnace temperature test will be conducted for the corresponding boards during mass production.
There are also special requirements for PCB storage. The incoming packaging must be vacuum packaging, and the board also needs to be relatively dry without moisture, otherwise the pad of the board is easy to oxidize. In addition, plates with BGA and thicker thickness need to be baked before patch production. The baking time depends on the plate specification, usually 4 hours or 8 hours.
PCB testing: PCB factories have two testing methods for produced PCBs. Flying Probe is generally used for small batch production, and test racks need to be made for large batch production.
