SMT (surface mount technology) chip processing is a technology widely used in electronic manufacturing, which includes many steps to ensure the accurate installation and welding of components on PCB (printed circuit board).
First, the solder paste is stirred. Solder paste needs to be thawed before use and stirred by hand or machine to ensure its good printing and welding performance. Proper stirring can make the composition of solder paste evenly distributed and avoid uneven phenomenon in printing.
Next is solder paste printing. This step accurately prints the solder paste onto the pads of the PCB by using a scraper. This is a very critical step, because the distribution of solder paste directly affects the quality of subsequent welding.
SPI detection is close behind. SPI (Solder Paste Detector) is used to check the printing quality of solder paste, ensure the thickness and coverage of solder paste meet the requirements, and thus ensure the stability of welding effect.
Mounting is the process of placing components on PCB pads accurately. Through high-speed and high-precision operation, the mounter quickly and accurately mounts the components on the PCB.
Followed by reflow soldering. In this process, the PCB with attached components passes through the reflow oven, so that the solder paste melts and forms a solid solder joint to ensure the components are firmly connected to the PCB.
AOI inspection (automatic optical inspection) is used to scan and inspect welding quality. Identify the defective products in welding through automatic equipment to ensure that the welding quality of each PCB meets the standards.
Finally, repair. The defective products detected by AOI or manual inspection need to be repaired. The repair process includes manual welding and component replacement to ensure that the function and quality of each PCB meet the expected requirements.
