DFM (Design for Manufacturability) means exactly what it sounds like. It's designed with the manufacturing process in mind. So, where should we focus during the layout? These are the key areas that make-or-break manufacturability:
1. Trace Widths and Spacing: Every PCB manufacturer has a minimum trace width and minimum copper spacing. These depend on copper thickness, etching process, and board complexity.
2. Via Sizes and Types: Through-hole vias, Blind and buried vias, Microvias (for HDI designs)
3. Pad Geometry and Annular Ring
Pads must be sized based on both component package and plating tolerances. A via or hole without a proper annular ring is a structural risk.
4. Solder Mask and Paste Alignment: Solder mask defines the non-conductive layer that covers your board, leaving openings for pads and vias.
5. Component Placement and Clearance: DFM also means placing components where they can be built and soldered.
