Characteristics of Energy Storage PCB Board
1. It is difficult to find BGA chips and some finely spaced devices on energy storage PCB boards, mainly for charging and discharging;
2. Energy storage boards generally have thicker copper thickness, with most copper thicknesses exceeding 2oz; And it is mainly characterized by high current, accompanied by high voltage (reaching kilovolts).
3. Similarly, due to the operation of high currents, the board is more prone to overheating, so energy storage PCB boards will undergo heat dissipation treatment, such as drilling heat dissipation holes or adding some packaging heat dissipation shells.
Points to pay attention to in the design and manufacturing of energy storage PCBs:
Firstly, due to the presence of high currents, there will be disturbances in the power ground when flowing through high currents; Secondly, during the process of high current changes, it is easy to generate EMC interference radiation.
Therefore, when designing and manufacturing energy storage PCBs, we should pay attention to the following points:
1. Try to choose high-performance materials suitable for high current applications, such as FR-4, metal substrates, and composite materials, which have low resistance, high thermal conductivity, and good mechanical strength, and can withstand heat and current concentration effects under high currents.
2. The current distribution is balanced, and a reasonable current distribution can reduce the resistance and hotspot generation in the current path. For example, adding a balanced current transformer, balanced resistor, or current balance layer can improve the reliability and stability of the circuit board.
3. When wiring a PCB, try not to cross wire high current paths and digital signals to avoid mutual interference.
4. For high current paths, solid copper should be used as much as possible. Firstly, the current carrying capacity is relatively high, secondly, it will have good heat dissipation effect, and thirdly, it is necessary to avoid high impedance of the wiring and large voltage drop on the wiring.
5. The heat generated by high current can cause device damage and product damage, so the power path needs to be carefully considered. Generally, a large area of copper is laid, holes are drilled, and the external impedance welding layer is excavated to expose the copper skin, in order to accelerate heat dissipation.
6. When laying out, consideration should be given to the issue of high current EMC radiation, which can be achieved through methods such as thickening the line width, increasing the aperture, and increasing the spacing design. The high current path should be as short as possible, and when planning the path, it should be placed away from devices that are susceptible to interference (signal interference and thermal effects)
