1.SOP package introduction
SOP package (Small Out-Line Package) is a common electronic component packaging form, with the advantages of high system integration, low production cost, excellent performance, high reliability, etc. Among the many packaging forms, SOP package occupies half of the market with its unique advantages, with a market share of about 50%.
2.Technical features of SOP package:
- Convenient operation
The pin arrangement rules of SOP package facilitate precise operation on automated production lines, reduce the need for manual intervention, and improve production efficiency and yield rate.
- Reliability
SOP package can effectively protect the internal chip from external environment, such as moisture, dust and mechanical stress, ensuring the stability and long life of the chip.
- Optimization of electrothermal performance
The selection and design of packaging materials make SOP package excellent in heat dissipation, which can effectively control the operating temperature of the chip and avoid performance degradation or damage caused by overheating.
- Miniaturization and lightweight
The small size and lightweight design of SOP package make it an indispensable component in portable electronic devices, meeting the ultimate pursuit of space utilization of modern electronic products.
3.SOP packaging cleaning agent W3210 introduction:
SOP packaging cleaning agent W3210 is a water-based cleaning agent for electronic product post-weld residues with a pH-neutral formula independently developed by Heming. It is suitable for cleaning flux and tin residues on different types of electronic assemblies such as PCBA, including flux residues of semiconductor devices in packaging forms such as SIP and WLP. Due to its pH neutrality, it has excellent material compatibility with sensitive metals and polymer materials.
