Bubbles are present during mixing and stirring. During the mixing process, air is introduced. However, during the injection of the product and the entire curing process, if the vacuum is not sufficient or the time is not enough, the air is not completely removed.
Method for eliminating air bubbles: 1. It is recommended to vacuum the main agent and curing agent after mixing them together. 2. Preheating the product to be sealed will help with the escape of air. 3. Cure in a room with low temperature and humidity to allow enough time for air to escape.
Bubbles generated during the solidification process. There are several reasons for the formation of bubbles during the curing process: too fast curing speed, high heat release temperature, high shrinkage rate of the adhesive solution during curing, and excessive solvents and plasticizers in the adhesive solution that can easily generate bubbles during the curing process. To solve these problems during the curing process, it is necessary to adjust the overall composition of the adhesive water.
Method for eliminating air bubbles: 1. Use a professional electronic glue filling machine for sealing. Professional electronic glue filling machines have both mixed glue filling and vacuum glue filling devices, which are convenient and fast, suitable for large-scale production enterprises.
2. Before adjusting the glue, heat the glue solution at 25-30 ℃, and then mix the electronic potting glue according to the proportion. When adjusting the glue, stir clockwise and evenly, and do not mix too fast or too slow. When pouring glue, the speed should also be uniform, otherwise bubbles are easily generated.
3. Use low viscosity electronic sealant because low viscosity silicone is more prone to air bubbles.
