PCBA welding pores, what we call bubbles, are one of the common undesirable phenomena in PCBA welding. The main factors that produce bubbles are humidity and furnace temperature. First, let's talk about the humidity factor; PCB, electronic components and Excessive humidity in the production workshop can easily cause bubble problems during welding. PCBs and electronic components need to be heated and baked for sufficient time before processing to prevent moisture from existing on the board or components. During processing and production, the humidity in the production workshop should also be controlled between 40% and 60%, so as to eliminate the problem of welding bubbles caused by humidity factors;
The second is the furnace temperature control factor. Too fast heating and cooling, and too long stay time in the temperature zone will lead to welding pore problems. During welding, it is necessary to test the furnace temperature first and optimize the furnace temperature curve to prevent the temperature in the furnace from rising. Too fast or too slow temperature rise. At the same time, we should also pay attention to the issue of furnace passing time. When welding and passing through the furnace, we should control the residence time of different temperature zones to prevent the furnace passing speed from being too fast or too slow; except for humidity factors and In addition to furnace temperature factors, improper use of solder paste and flux can also lead to the occurrence of welding pores.
