How a reflow oven works
The reflow oven is actually a large oven, but the temperature of each zone in the reflow oven can be adjusted individually, and the solder paste on the circuit board is melted and welded with the smt components through different temperature changes. The reflow soldering furnace relies on the hot air flow in the furnace to act on the solder paste on the solder joints of the solder paste circuit board, so that the solder paste is remelted into liquid tin, and the SMT chip components and the circuit board are welded and fused together, and then reflow soldering. Furnace cooling forms solder joints. The soldering in the reflow oven is divided into four functional processes. The circuit boards with the smt components mounted are transported through the reflow oven guide rails, respectively, through the preheating area, heat preservation area, welding area, and cooling area of the reflow oven. After reflow soldering After the action of these four temperature zones of the furnace, a complete solder joint is formed.
Our BQC use the latest reflow oven equipment and reach 10 temperature zones. It’s more efficient.
