In the expanding changes, the components are becoming smaller and more complex. Therefore, the maximum test coverage in the production of electronic products is inevitable to maintain the highest level of quality. The days when a single test program was enough were long gone. The growing parts of electronic products and their importance to modern product functions make appropriate testing strategies a prerequisite for the production framework. The main influencing factor here is complexity, especially the quality and reliability requirements of corresponding products.
l The best test strategy starts with development
If it is within the scope of development, the specified circuit operates within its specified value, and a series of tests check the standard results, which must be monitored. This includes the specified components, material related characteristic variables as required, the correct installation position and the integrity of all connections. Since there are many components in the circuit, and each component has a suitable number of parameters, from a technical point of view, 100% reception inspection is neither economically feasible nor wise. Therefore, a progressive concept must be applied to combine various elements in an ideal way. Especially in the case of electrical testing through DFT analysis (Design for testability), this is guaranteed. Through the analysis of the circuit diagram, the network that must be contacted can be determined. Then compare it with the physical contact option on the PCB. Test strategies typically include the following steps:
1. Check the identity during receiving and ensure the traceability of the whole manufacturing process.
2. Automation, machine support, optical inspection integrity, correct positioning, correct number and quality of solder joints, short circuit (welding jumper)
3. Electrical measurement of component values and circuit parameters (such as voltage level)
4. Functional testing of parts or entire electronic equipment.
l Optical inspection system for early defect identification
After the identity check during reception, the first production step is usually solder paste printing for SMT production. This is essential for the complete welding of all component connections, so the first automatic optical inspection - SPI (solder paste inspection) is usually added at this stage.
Then place the components. Through active traceability, which manufacturer's batch will be placed at which installation point. After placement, the welding is carried out in a reflow furnace - ideally, automatic on-line inspection using AOI / Aoxi (automatic optical / X-ray inspection). This checks the integrity of the placement, the polarity of the element - if it can be identified by marking or shape - and the integrity and quality of the solder joint (using x-rays, also BGA, with invisible solder joints below the element).
BQC's standardized equipment and daily experience exchange throughout the company ensure the most advanced and best customer support. With multiple AOI / Aoxi systems, multiple ICT systems and hundreds of boundary scan and FCT systems, gtet is best equipped with machines and professional operators to implement the best and customized test / inspection strategy for their products and relevant customer requirements.
