High-density Interconnect (HDI) technology represents a core breakthrough in the PCBA (Printed Circuit Board Assembly) field, aiming to achieve more compact and high-performance electronic designs through miniaturized wiring. Traditional PCBS are limited by through-hole technology, while HDI PCBA adopts laser drilling, micro-blind buried holes and fine circuits (line width/spacing ≤50μm), enabling multi-layer boards to achieve more interconnections within a limited space and meeting the requirements of devices such as 5G modules for miniaturization and high-speed signals.
In PCBA manufacturing, the key advantages of HDI technology include:
Spatial optimization: Reduce the number of board layers through Any-layer interconnection (HDI) to lower the overall thickness of the PCBA
Signal integrity: Micro-holes shorten the transmission path and reduce high-frequency signal loss.
Reliability improvement: The stacked hole design enhances mechanical strength, making it suitable for harsh environments such as automotive electronics.
With the development of IC packaging towards 3D, HDI PCBA further integrates embedded components and rigid-flex combination processes, promoting innovative applications such as wearable devices and AI hardware. In the future, with the upgrading of materials and manufacturing processes, HDI will continue to empower the high-integration evolution of PCBA.
