There are many types of BGA packaged products, such as common computer graphics cards, north-south bridges, and CPUs. There are also BGA components in products such as mobile phones, projectors, and TVs. The main factors affecting the quality of BGA repair are as follows:
1. If the opened BGA components are not placed in a moisture-proof cabinet, the BGA needs to be baked and preheated to prevent the BGA from cracking when it is heated rapidly.
2. When soldering the solder balls, the quality of the solder balls needs to be guaranteed. Avoid using oxidized solder balls or solder balls contaminated with other impurities.
3. When soldering, it is necessary to apply a uniform and appropriate amount of flux paste on the PCB board, if too much, it will easily cause a short circuit.
4. Pay attention to the components around the BGA when soldering, and try to use the air nozzle to prevent heating to other components.
5. Some BGA components will be fixed by potting glue. At this time, the usual way is to continue heating and then pry the glue apart.
6. At the end of desoldering, please use a vacuum suction pen when moving BGA components and avoid using metal tweezers, which may damage the chip.
