With the continuous development of SMT electronic components towards miniaturization, chip integration is getting higher and higher. Whether it is notebook, smart phone, medical equipment, automobile electronics, military and aerospace products, array packaging BGA, CSP and other devices in the products are more and more applied, and the quality requirements of the products are also increasing.
5G is a hot word in 2019, but now the 5G era has begun. From the perspective of the PCBA circuit board of mobile phones, compared with 4G mobile phones, the design difficulties of 5G mobile phones are mainly focused on rf and antenna, in addition to baseband chips. Because 5G is at least 1 times higher than 4G frequency, 5 times wider than 4G frequency band, up to 29 frequency bands, 5 times higher than 4G power, 10 times higher than 4G speed, and dozens of times more antennas. This requires us to constantly improve the process capacity, increase high-end equipment, through high quality welding to ensure high reliability of products.
Analysis of various processes for PCBA highly reliable welding
In the high-precision electronic manufacturing process, there are many SMT production equipment, the main automation equipment is SMT automatic X-ray spot machine, SMT first piece detector, automatic solder paste printing machine, online 3D-SPI solder paste printing detector, SMT placement machine, reflow welding, online AOI optical detector, online PCBA automatic milling cutter board machine and so on.
