Typical environmental test of plate components: temperature shock, rapid temperature change, condensation, mechanical shock, mechanical vibration, high temperature and high humidity, etc.;
Non-destructive testing analysis: X-ray fluoroscopy, high-resolution CT imaging, acoustic scanning microscope, infrared thermal imaging, etc.;
Electrical performance testing: surface insulation resistance (SIR), volume resistivity, breakdown strength, dielectric strength, etc.;
Welding quality and mechanical performance analysis: chip clipper, bonding tape tension, cutting board/reflow stress and strain analysis, dyeing and penetration, etc.;
Slicing and sample preparation of plate components: automatic cutting, grinding, polishing, micro-etching, etc.;
Solder joint defect detection: stereo microscope, metallographic microscope, large depth of field microscope, scanning electron microscope, etc.;
Assembly material composition detection: EDX, AES, secondary ion mass spectrometry SIMS, infrared spectroscopy, chromatography, mass spectrometry;
Cleanliness detection: ion chromatography, conductivity equivalent method, etc.
Thermomechanical performance analysis: differential scanning calorimetry, thermogravimetric analysis, thermal stress test, hot oil test, etc.
