The quality of solder joint in PCBA processing is the most important. The reliability of solder joint quality determines the reliability and service life of PCBA products. Once the solder joint fails, the PCBA will be repaired or scrapped. Improving the reliability of solder joint is one of the machining objectives of electronic processing plant. What are the causes of solder joint failure and how to improve the reliability? The following professional PCBA factory pate technology to give you a brief introduction.
1、 Causes of solder joint failure:
The main causes of solder joint failure are as follows:
1. Poor pin of components: coating, pollution, oxidation, coplanar;
2. Bad PCB pad: coating, pollution, oxidation, warpage;
3. Solder quality defects: composition, impurities exceeding the standard, oxidation;
4. Flux quality defects: low flux, high corrosion and low sir;
5. Defects in process parameter control: design, control and equipment;
6. Other auxiliary material defects: adhesive, cleaning agent.
2、 Reliability improvement method:
1. The main purpose is to analyze and identify the reliability of PCBA solder joints and provide reference parameters for machining;
2. In order to improve the reliability of solder joints in the process of processing, the failure solder joints are carefully analyzed and the causes of failure are found out. Then the process improvement is carried out to gradually solve the solder joint failure problem.
