In the process of PCBA processing, many customers will encounter the situation that SMT small batch SMT chip processing factory confirms whether to do lead-free process or lead-free process. What is the difference between the two processing technologies? In fact, it can be understood literally that the difference between the lead-free process and the lead-free process in the SMT chip proofing process is the lead content in the solder paste. Some friends may think that the lead-free process has no lead at all, which is also wrong. In fact, there is lead in the solder paste of lead-free process, but it accounts for a relatively small proportion.
Which of the two processes is better? Lingzhuo SMT proofing to share with friends in need:
1、 The melting point of lead tin is 180 ~ 185 ℃, and the working temperature is about 240 ~ 250 ℃. The melting point of lead-free tin is 210 ~ 235 ℃, and the working temperature is 245 ° to 280 ° C.
2、 In SMT SMT process, 63 / 37 Sn / 37 Sn and 0.5% Sn, 3% Ag and 0.5% Cu are the lead-free alloys. Although the lead-free process is not completely free of lead, the content is generally very low.
3、 We all know that the price of tin is more expensive than that of lead, so the cost of solder will be higher after replacing lead with tin. This is one of the main reasons why the lead-free process is more expensive than the lead-free process when calculating the cost of SMT small batch SMT chip processing plant.
4、 There are lead technology and lead-free process, which can be seen from the name. But specific to the process, that is to use solder, components and equipment, such as wave soldering furnace, solder paste printing machine, soldering iron for manual welding, etc.
