PCBA processing process involves a series of processes, such as PCB board manufacturing, PCBA incoming components procurement and inspection, SMT chip processing, plug-in processing, program firing, testing, aging and so on. The supply chain and manufacturing chain are long. Any defect in any link will lead to the unqualified quality of PCBA board in large quantities, which will lead to serious consequences. In this case, the quality control of PCBA chip processing is a very important quality assurance in electronic processing, so what are the main quality control of PCBA processing?
It is particularly important to hold a pre production meeting after receiving PCBA processing order. It mainly analyzes the process of PCB Gerber documents and submits manufacturability reports (DFM) according to different customer requirements. Many small manufacturers do not pay attention to this, but tend to do so. It is not only easy to produce bad quality problems caused by bad PCB design, but also a lot of rework and repair work.
2. Purchase and inspection of PCBA components
It is necessary to strictly control the procurement channels of components and parts, and the goods must be taken from large traders and original manufacturers, so as to avoid the use of second-hand materials and counterfeit materials. In addition, it is necessary to set up a special PCBA incoming material inspection post to strictly inspect the following items to ensure that there is no fault in the components.
PCB: check reflow oven temperature test, no fly wire through hole is blocked or ink leakage, board surface bending, etc.
IC: check whether screen printing and BOM are exactly the same, and store them at constant temperature and humidity.
Other commonly used materials: check screen printing, appearance, power measurement, etc.
3. SMT assembly
Solder paste printing and reflow furnace temperature control system is the key point of assembly, which requires the use of laser steel mesh with higher quality requirements and better meet the processing requirements. According to the requirements of PCB, some steel mesh holes or U-shaped holes need to be added or reduced, and only steel mesh can be made according to the process requirements. The temperature control of reflow furnace is very important for the wetting of solder paste and the firmness of steel mesh welding, which can be adjusted according to the normal SOP operation guide.
In addition, the strict implementation of AOI testing can greatly reduce the adverse effects caused by human factors.4. Plug in processing
In the process of plug-in, the mold design of over wave soldering is the key. How to use the mold to improve the yield of good products is a process that PE engineers must continue to practice and summarize.
5. Programmed firing
In the previous DFM report, customers can be advised to set some test points on PCB (test point) to test the circuit continuity of PCBA processing circuit after PCB welding all parts. If possible, customers can be required to provide programs, which can be burned into the main control IC through a burner, which can test various touch actions more intuitively, so as to verify the functional integrity of the whole PCBA.
6. PCBA processing board test
For orders with PCBA test requirements, the main test contents include ICT (circuit test), FCT (function test), burn test (aging test), temperature and humidity test, drop test, etc
