1. Welding Problems
Hot Solder: Hot soldering means that there is no effective soldering between the pins of the components and the pads. This may be caused by insufficient solder paste, insufficient soldering temperature or too short soldering time.
Cold soldering: Cold soldering is characterized by a rough, gray and dull soldering point surface. This is usually because the soldering temperature is too low, resulting in the soldering material not being completely melted.
Connected soldering: Connected soldering means that a connection is formed between soldering points that should not be connected. This may be because too much solder paste is applied, or the pins of two adjacent components are too close.
2. Component problems
Component damage: Due to static electricity, overheating, mechanical stress, etc., components may be damaged during processing, resulting in performance degradation or complete failure.
Component misalignment: During the patch process, components may be misaligned due to various reasons (such as equipment failure, operating errors, etc.), resulting in misalignment with the pads on the PCB.
3. PCB Problems
PCB contamination: PCB may be contaminated during production and storage, such as oil stains, dust, etc. These pollutants may affect the welding effect and cause adverse phenomena.
PCB deformation: PCB may deform in high temperature, humidity and other environments, affecting the placement and welding of components.
4. Quality control issues
Missed inspection: Due to failure of the inspection equipment, operational errors, etc., some defective products may not be detected in time and flow into the next process or market.
Mixed materials: During the production process, components or PCBs of different models and specifications may be mixed, resulting in product performance not meeting requirements.
