BGA maintenance to bear in mind the following issues:
(1) To prevent overtemperature damage in the process of desoldering, the temperature of the hot air gun should be adjusted in advance when desoldering. The required temperature is (280~320℃), and the temperature is forbidden to be adjusted when desoldering.
(2) To prevent static electricity accumulation and damage, static electricity bracelet must be worn before operation.
(3) to prevent damage to the air flow and pressure of the hot air gun demolition welding, the air flow and pressure of the hot air gun should be adjusted in advance when the demolition welding, and the air flow and pressure are forbidden to be mobilized when the demolition welding.
(4) prevent pulling PCBA on the BGA pad, the removal of the welding process can be tweezers gently touch BGA to confirm whether the tin is molten, such as the tin side can be removed, such as not molten tin need to continue to heat to molten tin. Note: Gently touch and do not force during operation.
⑤ Pay attention to the positioning and direction of BGA on PCBA to prevent secondary ball planting welding.
