1. Surface assembly components and crimp components, has a good process.preferred surface assembly and crimp components
Crimped components are mainly multi-pin connectors. This type of package also has good processability and connection reliability, and is also a preferred category.
With the development of component packaging technology, the vast majority of components can be purchased for reflow soldering package categories, including plug-in components that can be used for through-hole reflow soldering. If the design can achieve full surface assembly, it will greatly improve the efficiency and quality of assembly.
2. As a PCBA assembly, consider the package dimensions and pin pitch as a whole
The greatest impact on the entire board processability is the package size and pin spacing. Under the premise of selecting the surface assembly components, it is necessary to select a group of PCBs with similar processability or a certain thickness of stencil for solder paste printing for a specific size and assembly density PCB. For example, the mobile phone board, the selected package is suitable for solder paste printing with a 0.1 mm thick stencil.
3. Shorten the process path
The shorter the process path, the higher the production efficiency and the more reliable the quality.
